Test cost analysis for 3D die-to-wafer stacking

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

52 Citations (Scopus)

Original language	English
Title of host publication	Proc. of the 19th Asian test symposium
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE
Pages	435-441
Number of pages	7
ISBN (Print)	978-0-7695-4248-5
Publication status	Published - 2010
Event	ATS 2010 - Piscataway Duration: 1 Dec 2010 → 4 Dec 2010

Name
Publisher	IEEE

Conference	ATS 2010
Period	1/12/10 → 4/12/10

Keywords

@inproceedings{6224d1bffe7d4871a86124889c16838e,

title = "Test cost analysis for 3D die-to-wafer stacking",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Taouil and S Hamdioui and CIM Beenakker and E Marinissen",

year = "2010",

language = "English",

isbn = "978-0-7695-4248-5",

publisher = "IEEE",

pages = "435--441",

editor = "s.n.",

booktitle = "Proc. of the 19th Asian test symposium",

address = "United States",

note = "ATS 2010 ; Conference date: 01-12-2010 Through 04-12-2010",

}

TY - GEN

T1 - Test cost analysis for 3D die-to-wafer stacking

AU - Taouil, M

AU - Hamdioui, S

AU - Beenakker, CIM

AU - Marinissen, E

PY - 2010

Y1 - 2010

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-0-7695-4248-5

SP - 435

EP - 441

BT - Proc. of the 19th Asian test symposium

A2 - s.n., null

PB - IEEE

CY - Piscataway

T2 - ATS 2010

Y2 - 1 December 2010 through 4 December 2010

ER -