Test cost analysis for 3D die-to-wafer stacking

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

52 Citations (Scopus)
Original languageEnglish
Title of host publicationProc. of the 19th Asian test symposium
Editors s.n.
Place of PublicationPiscataway
PublisherIEEE Society
Pages435-441
Number of pages7
ISBN (Print)978-0-7695-4248-5
Publication statusPublished - 2010
EventATS 2010 - Piscataway
Duration: 1 Dec 20104 Dec 2010

Publication series

Name
PublisherIEEE

Conference

ConferenceATS 2010
Period1/12/104/12/10

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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