Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	English
Pages (from-to)	1-11
Number of pages	11
Journal	Journal of Electronic Testing: theory and applications
Issue number	10836
Publication status	Published - 2011

Keywords

@article{0628e0a8dc374ddc80ec48bcbe628b8d,

title = "Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost",

keywords = "CWTS JFIS < 0.75",

author = "M Taouil and S Hamdioui and CIM Beenakker and E Marinissen",

year = "2011",

language = "English",

pages = "1--11",

journal = "Journal of Electronic Testing: theory and applications",

issn = "0923-8174",

publisher = "Springer",

number = "10836",

}