Abstract
As STT-MRAM mass production and deployment in industry is around the corner, high-quality yet cost-efficient manufacturing test solutions are crucial to ensure the required quality of products being shipped to end customers. This dissertation focuses on STT-MRAM testing, covering three abstraction levels: manufacturing defects, fault models, and test solutions. We apply the advanced device-aware test (DAT) approach to STT-MRAM defects, including resistive defects on interconnects and STT-MRAM device-internal defects such as pinhole defects, synthetic anti-ferromagnet flip defects, intermediate state defects. With the derived accurate defect models calibrated by silicon data, a comprehensive fault analysis based on SPICE circuit simulations is performed. STT-MRAM unique faults are identified, including both permanent faults and intermittent faults. Based on the obtain fault models, high-quality test solutions are proposed. Additionally, this dissertation also explores the impact of magnetic coupling and density on STT-MRAM performance for robust designs.
Original language | English |
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Qualification | Doctor of Philosophy |
Awarding Institution |
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Supervisors/Advisors |
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Award date | 22 Feb 2021 |
Print ISBNs | 978-94-6384-199-3 |
DOIs | |
Publication status | Published - 2021 |
Keywords
- memory test
- device-aware test
- manufacturing test
- STT-MRAM
- MTJ
- manufacturing defect
- fault model
- robust design
- magnetic coupling