The aesthetic appeal of depth of field in photographs

T Zhang; HT Nefs; JA Redi; IEJR Heynderickx

doi:10.1109/QoMEX.2014.6982300

The aesthetic appeal of depth of field in photographs

T Zhang, HT Nefs, JA Redi, IEJR Heynderickx

Interactive Intelligence

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

5 Citations (Scopus)

Original language	English
Title of host publication	Sixth International Workshop on Quality of Multimedia Experience
Editors	S Winkler
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE
Pages	81-86
Number of pages	6
ISBN (Print)	978-1-4799-6536-6
DOIs	https://doi.org/10.1109/QoMEX.2014.6982300
Publication status	Published - 2014
Event	QoMEX 2014, Singapore, Singapore - Piscataway, NJ, USA Duration: 18 Sept 2014 → 20 Sept 2014

Publication series

Name
Publisher	IEEE

Conference

Conference	QoMEX 2014, Singapore, Singapore
Period	18/09/14 → 20/09/14

Bibliographical note

Harvest

Access to Document

10.1109/QoMEX.2014.6982300

Cite this

@inproceedings{a87e59b7d9aa46c1a78e6d1403524d0d,

title = "The aesthetic appeal of depth of field in photographs",

author = "T Zhang and HT Nefs and JA Redi and IEJR Heynderickx",

note = "Harvest; QoMEX 2014, Singapore, Singapore ; Conference date: 18-09-2014 Through 20-09-2014",

year = "2014",

doi = "10.1109/QoMEX.2014.6982300",

language = "English",

isbn = "978-1-4799-6536-6",

publisher = "IEEE",

pages = "81--86",

editor = "S Winkler",

booktitle = "Sixth International Workshop on Quality of Multimedia Experience",

address = "United States",

}

TY - GEN

T1 - The aesthetic appeal of depth of field in photographs

AU - Zhang, T

AU - Nefs, HT

AU - Redi, JA

AU - Heynderickx, IEJR

N1 - Harvest

PY - 2014

Y1 - 2014

U2 - 10.1109/QoMEX.2014.6982300

DO - 10.1109/QoMEX.2014.6982300

M3 - Conference contribution

SN - 978-1-4799-6536-6

SP - 81

EP - 86

BT - Sixth International Workshop on Quality of Multimedia Experience

A2 - Winkler, S

PB - IEEE

CY - Piscataway, NJ, USA

T2 - QoMEX 2014, Singapore, Singapore

Y2 - 18 September 2014 through 20 September 2014

ER -