The application of RSM in optimization of the curing profile for electronic packaging polymers

F Huang; Y Gong; Q Li; D Yang

The application of RSM in optimization of the curing profile for electronic packaging polymers

F Huang, Y Gong, Q Li, D Yang

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of 2005 6th International Conference on Electronic Packaging Technology
Editors	Keyun, Bi, Chunqing, Wang
Place of Publication	Piscataway, New Jersey
Publisher	IEEE
Pages	221-225
Number of pages	5
ISBN (Print)	0-7803-9449-6
Publication status	Published - 2005
Event	2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China - Piscataway, New Jersey Duration: 30 Aug 2005 → 2 Sept 2005

Publication series

Name
Publisher	IEEE

Conference

Conference	2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China
Period	30/08/05 → 2/09/05

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{671ef858a77240f183434b452b368c61,

title = "The application of RSM in optimization of the curing profile for electronic packaging polymers",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "F Huang and Y Gong and Q Li and D Yang",

year = "2005",

language = "Undefined/Unknown",

isbn = "0-7803-9449-6",

publisher = "IEEE",

pages = "221--225",

editor = "Keyun and Bi and Chunqing and Wang",

booktitle = "Proceedings of 2005 6th International Conference on Electronic Packaging Technology",

address = "United States",

note = "2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China ; Conference date: 30-08-2005 Through 02-09-2005",

}

Huang, F, Gong, Y, Li, Q & Yang, D 2005, The application of RSM in optimization of the curing profile for electronic packaging polymers. in Keyun, Bi, Chunqing & Wang (eds), Proceedings of 2005 6th International Conference on Electronic Packaging Technology. IEEE, Piscataway, New Jersey, pp. 221-225, 2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China, 30/08/05.

The application of RSM in optimization of the curing profile for electronic packaging polymers. / Huang, F; Gong, Y; Li, Q et al.
Proceedings of 2005 6th International Conference on Electronic Packaging Technology. ed. / Keyun; Bi; Chunqing; Wang. Piscataway, New Jersey: IEEE, 2005. p. 221-225.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - The application of RSM in optimization of the curing profile for electronic packaging polymers

AU - Huang, F

AU - Gong, Y

AU - Li, Q

AU - Yang, D

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9449-6

SP - 221

EP - 225

BT - Proceedings of 2005 6th International Conference on Electronic Packaging Technology

A2 - Keyun, null

A2 - Bi, null

A2 - Chunqing, null

A2 - Wang, null

PB - IEEE

CY - Piscataway, New Jersey

T2 - 2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China

Y2 - 30 August 2005 through 2 September 2005

ER -