The effect of filler parameters on the healing of thermal conductivity and mechanical properties of a thermal interface material based on a self-healable organic-inorganic polymer matrix

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)

Abstract

Thermal interface materials (TIMs) are widely used in all kinds of electronic devices to handle the heat dissipation and the mechanical anchoring of the heat producing component. The aging of TIMs may lead to delamination and internal crack formation causing a loss of heat transfer and mechanical integrity both leading to premature device failure. In the present work, a novel TIM system based on a self-healing organic-inorganic polymer matrix filled with spherical glass beads is presented which is capable of healing both the thermal conductivity and the mechanical properties upon thermal activation. The effect of particle volume concentration (PVC) and particle size on tensile strength and thermal conductivity healing behavior is investigated. The results show that a higher PVC increases the mechanical property but decreases mechanical healing. For the same PVC, bigger particles lead to lower mechanical properties but higher thermal conductivities and higher mechanical healing efficiencies.

Original languageEnglish
Article number084016
JournalSmart Materials and Structures
Volume25
Issue number8
DOIs
Publication statusPublished - 15 Jul 2016

Keywords

  • fracture strength
  • organic-inorganic networks
  • self-healing polymers
  • tetrasulfides
  • thermal conductivity
  • thermal interface materials

Fingerprint

Dive into the research topics of 'The effect of filler parameters on the healing of thermal conductivity and mechanical properties of a thermal interface material based on a self-healable organic-inorganic polymer matrix'. Together they form a unique fingerprint.

Cite this