The effect of sidewall roughness on line edge roughness in top-down scanning electron microscopy images

T Verduin, SR Lokhorst, P Kruit, CW Hagen

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    4 Citations (Scopus)
    Original languageEnglish
    Title of host publicationMetrology, Inspection, and Process Control for Microlithography XXIX
    EditorsJP Cain, MI Sanchez
    Place of PublicationBellingham, WA, USA
    PublisherSPIE
    Pages1-18
    Number of pages18
    ISBN (Print)9781628415261
    DOIs
    Publication statusPublished - 2015
    EventMetrology, Inspection, and Process Control for Microlithography XXIX - San Jose, CA, United States
    Duration: 23 Feb 201526 Feb 2015

    Publication series

    Name
    PublisherSPIE
    NameProceedings of SPIE- International Society for Optical Engineering
    Volume9424
    ISSN (Print)0277-786X

    Conference

    ConferenceMetrology, Inspection, and Process Control for Microlithography XXIX
    CountryUnited States
    CitySan Jose, CA
    Period23/02/1526/02/15

    Cite this

    Verduin, T., Lokhorst, SR., Kruit, P., & Hagen, CW. (2015). The effect of sidewall roughness on line edge roughness in top-down scanning electron microscopy images. In JP. Cain, & MI. Sanchez (Eds.), Metrology, Inspection, and Process Control for Microlithography XXIX (pp. 1-18). (Proceedings of SPIE- International Society for Optical Engineering; Vol. 9424). SPIE. https://doi.org/10.1117/12.2085768