The Effects of Packaging on RFICs

G Mandal, G Mishra, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

Rapid growth of wireless market and competitive pressure have pushed the electrical performance of Radio Frequency Integrated Circuits (RFICs) to next level. The performance of RFICs at microwave frequencies depends very much on the package parasitic. Hence, the choice of proper packages depending on application of RFICs is of utmost importance. This paper describes our investigation of the effects of packaging (technology and material) on the performance of RFICs for different application areas.
Original languageUndefined/Unknown
Title of host publicationProceedings of 2006 7th International Conference on Electronics Packaging Technology
Editors Sheng Liu
Place of PublicationShanghai, China
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages166-172
Number of pages7
ISBN (Print)1-4244-0620-X
Publication statusPublished - 2006
Event2006 7th International Conference on Electronics Packaging Technology - Shanghai. China
Duration: 26 Aug 200629 Aug 2006

Publication series

Name
PublisherInstitute of Electrical and Electronics Engineers, Inc.

Conference

Conference2006 7th International Conference on Electronics Packaging Technology
Period26/08/0629/08/06

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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