Rapid growth of wireless market and competitive pressure have pushed the electrical performance of Radio Frequency Integrated Circuits (RFICs) to next level. The performance of RFICs at microwave frequencies depends very much on the package parasitic. Hence, the choice of proper packages depending on application of RFICs is of utmost importance. This paper describes our investigation of the effects of packaging (technology and material) on the performance of RFICs for different application areas.
|Publisher||Institute of Electrical and Electronics Engineers, Inc.|
|Conference||2006 7th International Conference on Electronics Packaging Technology|
|Period||26/08/06 → 29/08/06|
- conference contrib. refereed
- Conf.proc. > 3 pag