Abstract
Packaging is an indispensable part in microelectronics manufacturing industry, where transfer molding as an essential step is typically included for encapsulation. Recently, with the fruitful achievements of research on graphene in gas sensing, there is also urgent need for study on how the packaging process will affect the graphene, to develop compatible manufacture protocol for practical graphene-based gas sensor. In this work, we carried out experiments on how molding compound outgassing affects graphene for gas sensing. Our results show that although there is some impact on the electrical properties of the graphene, there is no change in the microstructure, and only a slight and manageable change in gas sensing abilities. This work suggests that graphene could maintain performances after epoxy molding packaging processes.
| Original language | English |
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| Title of host publication | Proceedings of the 2024 IEEE Sensors |
| Publisher | IEEE |
| Number of pages | 4 |
| ISBN (Electronic) | 979-8-3503-6351-7 |
| ISBN (Print) | 979-8-3503-6352-4 |
| DOIs | |
| Publication status | Published - 2024 |
| Event | 2024 IEEE Sensors, SENSORS 2024 - Kobe, Japan Duration: 20 Oct 2024 → 23 Oct 2024 |
Publication series
| Name | Proceedings of IEEE Sensors |
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| ISSN (Print) | 1930-0395 |
| ISSN (Electronic) | 2168-9229 |
Conference
| Conference | 2024 IEEE Sensors, SENSORS 2024 |
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| Country/Territory | Japan |
| City | Kobe |
| Period | 20/10/24 → 23/10/24 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- gas sensing
- graphene
- molding compound outgassing
- packaging