The mechanical effects of kissing bonding defects in hybrid metal-composite laminates

Magda Droździel, Piotr Podolak, Davide Nardi, Patryk Jakubczak

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Abstract

Fibre metal laminates (FML) are hybrid materials perspective for wind-turbine, containers and marine objects, besides the aerospace industry. During the manufacturing process some faults can occur and can be hazardous for the reliability of FML structures. One of the most critical defects are kissing bonding due to their lack of detectability and strength compared to traditional delamination defect. The quantitative explanation were under consideration, such as loads effects; material properties; prediction of response; fracture analysis. The purpose of this work is the evaluation the impact of this type of defect on the part in-plane and the out-of-plane mechanical properties. It was presented that even responsive NDT methods are not able to detects the kissing bonding defect in FML components. Simultaneously, the kissing bonding impact on mechanical properties in FML is significant. In the case of FMLs with the orientation of the fibre perpendicular to the peel direction there is one failure pattern which is interlayer fracture. Whereas in the case of FMLs with the direction of the fibres longitudinal to the peel direction two failure patterns occur which is interlayer fracture and translaminar fibre crack. Depending on the kissing bonding area width the interlayer fracture in the composite can be observed until kissing bonding defect area and then transmission of the crack to the metal/composite interface through the fibres. In the case of low extension of poor adhesion area, the two parallel interlaminar cracking can be seen, one at the metal/composite interface in poor adhesion area, the second continuous in the composite layer.

Original languageEnglish
Article number114027
Number of pages14
JournalComposite Structures
Volume269
DOIs
Publication statusPublished - 2021

Keywords

  • Adhesion
  • FML
  • Kissing bonds
  • NDT
  • Single lap
  • T-peel

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