@inproceedings{7dfcb3eef90e4bb1a44c1fb39c760db2,
title = "Thermal aging of molding compounds",
abstract = "The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the glass transition temperature increased and that these effects are accompanied with a relatively large amount of shrinkage. All effects can be interpreted in terms of the formation of an oxidized layer where extra crosslinking occurred.",
keywords = "conference contrib. refereed, Geen BTA classificatie",
author = "KMB Jansen and {de Vreugd}, J and LJ Ernst and C Bohm",
year = "2010",
language = "English",
isbn = "978-1-4244-8140-8",
publisher = "IEEE Society",
pages = "778--780",
editor = "n.a.",
booktitle = "Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China",
note = "11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Xi'an, China ; Conference date: 16-08-2010 Through 19-08-2010",
}