Thermal analysis and optimization of IGBT power electronic module based on layout model

Hongyu Tang; Huaiyu Ye; Mingming Wang; Xuejun Fan; Guoqi Zhang

doi:10.1109/ICEPT.2016.7583115

Thermal analysis and optimization of IGBT power electronic module based on layout model

Hongyu Tang, Huaiyu Ye, Mingming Wang, Xuejun Fan, Guoqi Zhang

Electronic Components, Technology and Materials

Research output: Other contribution › Scientific

Abstract

In this work, one layout model of insulated gate bipolar transistor (IGBT) module are built by using a general analytical solution, which is used to analyze the effect of thermal spreading resistance on the whole temperature distribution of a rectangular board with multiple eccentric heat sources. IGBT power electronic module is optimized by changing the arrangement of IGBT and FRD chips on the cooling system with consideration of junction temperature (T j ), temperature uniformity. According to the thermal analysis and optimization on the layout models, quantitative designs of IGBT power electronic module for chip arrangement are achieved.

Original language	English
Publisher	IEEE
Number of pages	6
ISBN (Print)	978-1-5090-1397-5
ISBN (Electronic)	978-1-5090-1396-8
DOIs	https://doi.org/10.1109/ICEPT.2016.7583115
Publication status	Published - 16 Aug 2016

Keywords

Thermal analysis
IGBT power electronic module
Optimization
Layout model

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10.1109/ICEPT.2016.7583115

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title = "Thermal analysis and optimization of IGBT power electronic module based on layout model",

abstract = "In this work, one layout model of insulated gate bipolar transistor (IGBT) module are built by using a general analytical solution, which is used to analyze the effect of thermal spreading resistance on the whole temperature distribution of a rectangular board with multiple eccentric heat sources. IGBT power electronic module is optimized by changing the arrangement of IGBT and FRD chips on the cooling system with consideration of junction temperature (T j ), temperature uniformity. According to the thermal analysis and optimization on the layout models, quantitative designs of IGBT power electronic module for chip arrangement are achieved.",

keywords = "Thermal analysis, IGBT power electronic module, Optimization, Layout model",

author = "Hongyu Tang and Huaiyu Ye and Mingming Wang and Xuejun Fan and Guoqi Zhang",

year = "2016",

month = aug,

day = "16",

doi = "10.1109/ICEPT.2016.7583115",

language = "English",

isbn = "978-1-5090-1397-5",

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T1 - Thermal analysis and optimization of IGBT power electronic module based on layout model

AU - Tang, Hongyu

AU - Ye, Huaiyu

AU - Wang, Mingming

AU - Fan, Xuejun

AU - Zhang, Guoqi

PY - 2016/8/16

Y1 - 2016/8/16

N2 - In this work, one layout model of insulated gate bipolar transistor (IGBT) module are built by using a general analytical solution, which is used to analyze the effect of thermal spreading resistance on the whole temperature distribution of a rectangular board with multiple eccentric heat sources. IGBT power electronic module is optimized by changing the arrangement of IGBT and FRD chips on the cooling system with consideration of junction temperature (T j ), temperature uniformity. According to the thermal analysis and optimization on the layout models, quantitative designs of IGBT power electronic module for chip arrangement are achieved.

AB - In this work, one layout model of insulated gate bipolar transistor (IGBT) module are built by using a general analytical solution, which is used to analyze the effect of thermal spreading resistance on the whole temperature distribution of a rectangular board with multiple eccentric heat sources. IGBT power electronic module is optimized by changing the arrangement of IGBT and FRD chips on the cooling system with consideration of junction temperature (T j ), temperature uniformity. According to the thermal analysis and optimization on the layout models, quantitative designs of IGBT power electronic module for chip arrangement are achieved.

KW - Thermal analysis

KW - IGBT power electronic module

KW - Optimization

KW - Layout model

U2 - 10.1109/ICEPT.2016.7583115

DO - 10.1109/ICEPT.2016.7583115

M3 - Other contribution

SN - 978-1-5090-1397-5

PB - IEEE

ER -

Thermal analysis and optimization of IGBT power electronic module based on layout model

Abstract

Keywords

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