Thermal analysis of 3D integrated circuits based on discontinuous Galerkin finite element method

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

9 Citations (Scopus)

Abstract

IEEE Catalog Number CFP12250
Original languageEnglish
Title of host publicationProceedings of the 13th international symposium on quality electronic design
Place of PublicationPiscataway
PublisherIEEE Society
Pages117-122
Number of pages6
ISBN (Print)978-1-4673-1036-9
Publication statusPublished - 2012
Event13th International Symposium on Quality Electronic Design (ISQED), Santa Clara, USA - Piscataway
Duration: 19 Mar 201221 Mar 2012

Publication series

Name
PublisherIEEE

Conference

Conference13th International Symposium on Quality Electronic Design (ISQED), Santa Clara, USA
Period19/03/1221/03/12

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