Abstract
Purpose
- The purpose of this paper is to discuss the possibility of using soldering process for the bonding of chip-on-flexible (COF) light-emitting diode (LED) packages to heat sinks. The common bonding materials are thermal conductive adhesives. For thermal performance and reliability concerns, Tin-Bismuth (SnBi) lead-free solder paste was used for the connection of the COF packages and the Cu heat sinks by a soldering process in this study. Meanwhile, the geometrical effect of the SnBi solder layer on the thermal performance was also investigated.
Design/methodology/approach
- The effects of the bonding materials and the area of the solder layers on the thermal performance of the LED modules were investigated by finite element simulation and experimental tests.
Findings
– The SnBi soldered modules show much lower thermal resistance at the bonding layers than the adhesive-bonded LED module. Vertical heat transfer from the LED chips to the heat sinks is the primary heat dissipation mode for the SnBi soldered modules. Thus, the LED module with local solder layer shows similar LED thermal performance with the full-area soldered module. Meanwhile, the local soldering process decreases the possibility to form randomly distributed defects such as the large area voids and residue flux in the solder layers.
Research limitations/implications
– The research is still in progress. Further studies mainly focus on the reliability of the samples with different bonding materials.
Practical implications
– COF package is a new structure for LED packages. This study provides a comparison between SnBi solder and adhesive material on the thermal performance of the LED. Meanwhile, the authors optimized the geometrical design for the solder layer. The study provides a feasible bonding process for COF packages onto heat sinks.
Originality/value
– This study provides a soldering process for the COF LED packages. The thermal performance of the LED light source was improved significantly by the new process.
- The purpose of this paper is to discuss the possibility of using soldering process for the bonding of chip-on-flexible (COF) light-emitting diode (LED) packages to heat sinks. The common bonding materials are thermal conductive adhesives. For thermal performance and reliability concerns, Tin-Bismuth (SnBi) lead-free solder paste was used for the connection of the COF packages and the Cu heat sinks by a soldering process in this study. Meanwhile, the geometrical effect of the SnBi solder layer on the thermal performance was also investigated.
Design/methodology/approach
- The effects of the bonding materials and the area of the solder layers on the thermal performance of the LED modules were investigated by finite element simulation and experimental tests.
Findings
– The SnBi soldered modules show much lower thermal resistance at the bonding layers than the adhesive-bonded LED module. Vertical heat transfer from the LED chips to the heat sinks is the primary heat dissipation mode for the SnBi soldered modules. Thus, the LED module with local solder layer shows similar LED thermal performance with the full-area soldered module. Meanwhile, the local soldering process decreases the possibility to form randomly distributed defects such as the large area voids and residue flux in the solder layers.
Research limitations/implications
– The research is still in progress. Further studies mainly focus on the reliability of the samples with different bonding materials.
Practical implications
– COF package is a new structure for LED packages. This study provides a comparison between SnBi solder and adhesive material on the thermal performance of the LED. Meanwhile, the authors optimized the geometrical design for the solder layer. The study provides a feasible bonding process for COF packages onto heat sinks.
Originality/value
– This study provides a soldering process for the COF LED packages. The thermal performance of the LED light source was improved significantly by the new process.
| Original language | English |
|---|---|
| Pages (from-to) | 42-46 |
| Number of pages | 5 |
| Journal | Microelectronics International: an international journal |
| Volume | 33 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2016 |
Keywords
- Soldering
- Advanced packaging
- Chip-on-board (COB)
- Packaging
- Chip-on-flexible (COF)