Thermal and mechanical effects of voids within flip chip soldering in LED packages

Y Liu; SYY Leung; J Zhao; CKY Wong; CA Yuan; GQ Zhang; F Sun; L Luo

doi:10.1016/j.microrel.2014.07.034

Thermal and mechanical effects of voids within flip chip soldering in LED packages

Y Liu, SYY Leung, J Zhao, CKY Wong, CA Yuan, GQ Zhang, F Sun, L Luo

Electronic Components, Technology and Materials

Research output: Contribution to journal › Article › Scientific › peer-review

38 Citations (Scopus)

Original language	English
Pages (from-to)	2028-2033
Number of pages	6
Journal	Microelectronics Reliability
Volume	54
Issue number	9-10
DOIs	https://doi.org/10.1016/j.microrel.2014.07.034
Publication status	Published - 2014

Bibliographical note

Harvest
Available online 2-8-2014

Access to Document

10.1016/j.microrel.2014.07.034

Cite this

@article{0261656a47be463c99956b83b432ab35,

title = "Thermal and mechanical effects of voids within flip chip soldering in LED packages",

author = "Y Liu and SYY Leung and J Zhao and CKY Wong and CA Yuan and GQ Zhang and F Sun and L Luo",

note = "Harvest Available online 2-8-2014",

year = "2014",

doi = "10.1016/j.microrel.2014.07.034",

language = "English",

volume = "54",

pages = "2028--2033",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

number = "9-10",

}

TY - JOUR

T1 - Thermal and mechanical effects of voids within flip chip soldering in LED packages

AU - Liu, Y

AU - Leung, SYY

AU - Zhao, J

AU - Wong, CKY

AU - Yuan, CA

AU - Zhang, GQ

AU - Sun, F

AU - Luo, L

N1 - Harvest Available online 2-8-2014

PY - 2014

Y1 - 2014

U2 - 10.1016/j.microrel.2014.07.034

DO - 10.1016/j.microrel.2014.07.034

M3 - Article

SN - 0026-2714

VL - 54

SP - 2028

EP - 2033

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 9-10

ER -