Thermal and mechanical effects of voids within flip chip soldering in LED packages

Y Liu, SYY Leung, J Zhao, CKY Wong, CA Yuan, GQ Zhang, F Sun, L Luo

Research output: Contribution to journalArticleScientificpeer-review

34 Citations (Scopus)
Original languageEnglish
Pages (from-to)2028-2033
Number of pages6
JournalMicroelectronics Reliability
Volume54
Issue number9-10
DOIs
Publication statusPublished - 2014

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