Thermal-Aware Design and Runtime Management of 3D Stacked Multiprocessors

Research output: ThesisDissertation (TU Delft)

Original languageEnglish
QualificationDoctor of Philosophy
Supervisors/Advisors
  • van der Veen, A.J., Supervisor
  • van Leuken, T.G.R.M., Advisor
Award date15 Sep 2015
Electronic ISBNs978-94-6186-513-7
DOIs
Publication statusPublished - 15 Sep 2015

Keywords

  • 3D integrated circuits
  • multiprocessors
  • thermal-aware design
  • power management
  • temperature management
  • die stacking
  • through silicon vias
  • network on chip
  • memory hierarchy

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