Original language | English |
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Qualification | Doctor of Philosophy |
Supervisors/Advisors |
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Award date | 15 Sept 2015 |
Electronic ISBNs | 978-94-6186-513-7 |
DOIs | |
Publication status | Published - 15 Sept 2015 |
Keywords
- 3D integrated circuits
- multiprocessors
- thermal-aware design
- power management
- temperature management
- die stacking
- through silicon vias
- network on chip
- memory hierarchy