Thermal behaviour of epoxy resin filled with high thermal conductivity nanopowders

R Kochetov, T Andritsch, U Lafont, PHF Morshuis, SJ Picken, JJ Smit

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Abstract

    Abstract The improvement of heat conduction in electrical power equipment has become a very important issue. Thermoplastic and thermosetting polymers, which are mainly used for their insulating properties, have a relatively low thermal conductivity. One approach to change this is to introduce inorganic fillers which have high thermal conductivities compared to the polymer matrix. In this exploratory work we used commonly available bisphenol-A epoxy resin as a host material and high thermal conductivity nanopowders as fillers. Two types of nanopowders with different particles sizes and different ways of production have been used in this study. The content of nanopowder in the samples was varied from 0.5 to 10 % by weight. Morphological characterization of the prepared nanocomposites was carried out by transmission electron microscopy (TEM). The different models for predicting the thermal conductivity for two phase system are compared with experimental data of nanosized aluminum nitride and boron nitride particles filled epoxy composites. The Agari&Uno model correlated best with the experimental data.
    Original languageUndefined/Unknown
    Title of host publicationProceedings Electrical Insulation Conference, 2009. EIC 2009. IEEE
    Editors s.n.
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages524-528
    Number of pages5
    ISBN (Print)978-1-4244-3917-1
    DOIs
    Publication statusPublished - 2009
    EventElectrical Insulation Conference, 2009. EIC 2009. IEEE, Montreal - Piscataway
    Duration: 31 May 20093 Jun 2009

    Publication series

    Name
    PublisherIEEE

    Conference

    ConferenceElectrical Insulation Conference, 2009. EIC 2009. IEEE, Montreal
    Period31/05/093/06/09

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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