Thermal design guideline of PCB traces under DC and AC current

Y Wang; SWH de Haan; JA Ferreira

doi:doi:10.1109/ECCE.2009.5316250

Thermal design guideline of PCB traces under DC and AC current

Y Wang, SWH de Haan, JA Ferreira

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

17 Citations (Scopus)

Abstract

Abstract The demand on high power density tends to limit the area of printed circuit boards (PCB) and increase current density in PCB traces. A thermal design guideline which is able to reliably predict the current carrying capacity (CCC) of PCB traces will be valuable to PCB designers. This paper describes several design guidelines for trace CCC. They cannot be properly applied to today's PCB design characterized with high component density and high current density. The influence of effects, such as multilayers, corners and high frequency current undermines their use. These limitations are evidenced with experiments. Methods for developing a new design guideline which are practical for today's PCB design are introduced. Methods for temperature measurement and high frequency current generation are proposed as well.

Original language	Undefined/Unknown
Title of host publication	Proceedings IEEE Energy conversion congress and exposition, ECCE
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	1240-1246
Number of pages	7
ISBN (Print)	978-1-4244-2893-9
DOIs	https://doi.org/doi:10.1109/ECCE.2009.5316250
Publication status	Published - 2009
Event	IEEE Energy conversion congress and exposition, ECCE 2009, San Jose, USA - Piscataway Duration: 20 Sept 2009 → 24 Sept 2009

Publication series

Name
Publisher	IEEE

Conference

Conference	IEEE Energy conversion congress and exposition, ECCE 2009, San Jose, USA
Period	20/09/09 → 24/09/09

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Access to Document

doi:10.1109/ECCE.2009.5316250

Cite this

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title = "Thermal design guideline of PCB traces under DC and AC current",

abstract = "Abstract The demand on high power density tends to limit the area of printed circuit boards (PCB) and increase current density in PCB traces. A thermal design guideline which is able to reliably predict the current carrying capacity (CCC) of PCB traces will be valuable to PCB designers. This paper describes several design guidelines for trace CCC. They cannot be properly applied to today's PCB design characterized with high component density and high current density. The influence of effects, such as multilayers, corners and high frequency current undermines their use. These limitations are evidenced with experiments. Methods for developing a new design guideline which are practical for today's PCB design are introduced. Methods for temperature measurement and high frequency current generation are proposed as well.",

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note = "IEEE Energy conversion congress and exposition, ECCE 2009, San Jose, USA ; Conference date: 20-09-2009 Through 24-09-2009",

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T1 - Thermal design guideline of PCB traces under DC and AC current

AU - Wang, Y

AU - de Haan, SWH

AU - Ferreira, JA

PY - 2009

Y1 - 2009

N2 - Abstract The demand on high power density tends to limit the area of printed circuit boards (PCB) and increase current density in PCB traces. A thermal design guideline which is able to reliably predict the current carrying capacity (CCC) of PCB traces will be valuable to PCB designers. This paper describes several design guidelines for trace CCC. They cannot be properly applied to today's PCB design characterized with high component density and high current density. The influence of effects, such as multilayers, corners and high frequency current undermines their use. These limitations are evidenced with experiments. Methods for developing a new design guideline which are practical for today's PCB design are introduced. Methods for temperature measurement and high frequency current generation are proposed as well.

AB - Abstract The demand on high power density tends to limit the area of printed circuit boards (PCB) and increase current density in PCB traces. A thermal design guideline which is able to reliably predict the current carrying capacity (CCC) of PCB traces will be valuable to PCB designers. This paper describes several design guidelines for trace CCC. They cannot be properly applied to today's PCB design characterized with high component density and high current density. The influence of effects, such as multilayers, corners and high frequency current undermines their use. These limitations are evidenced with experiments. Methods for developing a new design guideline which are practical for today's PCB design are introduced. Methods for temperature measurement and high frequency current generation are proposed as well.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

U2 - doi:10.1109/ECCE.2009.5316250

DO - doi:10.1109/ECCE.2009.5316250

M3 - Conference contribution

SN - 978-1-4244-2893-9

SP - 1240

EP - 1246

BT - Proceedings IEEE Energy conversion congress and exposition, ECCE

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

T2 - IEEE Energy conversion congress and exposition, ECCE 2009, San Jose, USA

Y2 - 20 September 2009 through 24 September 2009

ER -