Thermal design guideline of PCB traces under DC and AC current

Y Wang, SWH de Haan, JA Ferreira

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    12 Citations (Scopus)

    Abstract

    Abstract The demand on high power density tends to limit the area of printed circuit boards (PCB) and increase current density in PCB traces. A thermal design guideline which is able to reliably predict the current carrying capacity (CCC) of PCB traces will be valuable to PCB designers. This paper describes several design guidelines for trace CCC. They cannot be properly applied to today's PCB design characterized with high component density and high current density. The influence of effects, such as multilayers, corners and high frequency current undermines their use. These limitations are evidenced with experiments. Methods for developing a new design guideline which are practical for today's PCB design are introduced. Methods for temperature measurement and high frequency current generation are proposed as well.
    Original languageUndefined/Unknown
    Title of host publicationProceedings IEEE Energy conversion congress and exposition, ECCE
    Editors s.n.
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages1240-1246
    Number of pages7
    ISBN (Print)978-1-4244-2893-9
    DOIs
    Publication statusPublished - 2009
    EventIEEE Energy conversion congress and exposition, ECCE 2009, San Jose, USA - Piscataway
    Duration: 20 Sep 200924 Sep 2009

    Publication series

    Name
    PublisherIEEE

    Conference

    ConferenceIEEE Energy conversion congress and exposition, ECCE 2009, San Jose, USA
    Period20/09/0924/09/09

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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