Thermal error reduction by topology optimisation

EC Hooijkamp, F van Keulen, J van Eijk

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of the EUSPEN Special Interest Group - Thermal Issues
Editors	H Bosse, J van Eijk
Place of Publication	Cranfield University, UK
Publisher	EUSPEN
Pages	53-59
Number of pages	7
Publication status	Published - 2014
Event	EUSPEN Special Interest Group: Thermal Issues, Zürich, Switzerland - Cranfield University, UK Duration: 19 Mar 2014 → 20 Mar 2014

Name
Publisher	EUSPEN

Conference	EUSPEN Special Interest Group: Thermal Issues, Zürich, Switzerland
Period	19/03/14 → 20/03/14

NEO

Cite this

@inproceedings{cc11fe70b1f5428f83393cf987bc3896,

title = "Thermal error reduction by topology optimisation",

author = "EC Hooijkamp and {van Keulen}, F and {van Eijk}, J",

note = "NEO; EUSPEN Special Interest Group: Thermal Issues, Z{\"u}rich, Switzerland ; Conference date: 19-03-2014 Through 20-03-2014",

year = "2014",

language = "English",

publisher = "EUSPEN",

pages = "53--59",

editor = "H Bosse and {van Eijk}, J",

booktitle = "Proceedings of the EUSPEN Special Interest Group - Thermal Issues",

}

TY - GEN

T1 - Thermal error reduction by topology optimisation

AU - Hooijkamp, EC

AU - van Keulen, F

AU - van Eijk, J

N1 - NEO

PY - 2014

Y1 - 2014

UR - http://www.euspen.eu/Portals/0/Content/2000-2013/Resources/Proceedings/2014%20Thermal%20Contents%20Pages.pdf

M3 - Conference contribution

SP - 53

EP - 59

BT - Proceedings of the EUSPEN Special Interest Group - Thermal Issues

A2 - Bosse, H

A2 - van Eijk, J

PB - EUSPEN

CY - Cranfield University, UK

T2 - EUSPEN Special Interest Group: Thermal Issues, Zürich, Switzerland

Y2 - 19 March 2014 through 20 March 2014

ER -