Thermal Expansion and Aging Effects in Neuromorphic Signal Processor

A. Zjajo, R. van Leuken

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
19 Downloads (Pure)

Abstract

In this paper, we propose an efficient methodology based on a real-time estimator and predictor-corrector scheme for accurate thermal expansion profile and aging evaluation of a neuromorphic signal processor circuit components. As the experimental results indicate, for comparable mesh size, the proposed method is 1~2 order of magnitude more accurate than corresponding, generalized finite element method.
Original languageEnglish
Title of host publication2016 IEEE International Nanoelectronics Conference (INEC)
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages1-2
Number of pages2
ISBN (Electronic)978-1-4673-8969-3
DOIs
Publication statusPublished - 13 Oct 2016
Event2016 IEEE International Nanoelectronics Conference - Chengdu, China
Duration: 9 May 201611 May 2016
http://www.inec2016.com/

Conference

Conference2016 IEEE International Nanoelectronics Conference
Abbreviated titleINEC
CountryChina
CityChengdu
Period9/05/1611/05/16
Internet address

Keywords

  • Neuromorphics
  • Aging
  • Thermal resistance
  • Thermal expansion
  • Integrated circuit modeling
  • Finite element analysis
  • Semiconductor device modeling

Fingerprint

Dive into the research topics of 'Thermal Expansion and Aging Effects in Neuromorphic Signal Processor'. Together they form a unique fingerprint.

Cite this