Abstract
In this paper, we propose an efficient methodology based on a real-time estimator and predictor-corrector scheme for accurate thermal expansion profile and aging evaluation of a neuromorphic signal processor circuit components. As the experimental results indicate, for comparable mesh size, the proposed method is 1~2 order of magnitude more accurate than corresponding, generalized finite element method.
Original language | English |
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Title of host publication | 2016 IEEE International Nanoelectronics Conference (INEC) |
Place of Publication | Piscataway, NJ |
Publisher | IEEE |
Pages | 1-2 |
Number of pages | 2 |
ISBN (Electronic) | 978-1-4673-8969-3 |
DOIs | |
Publication status | Published - 13 Oct 2016 |
Event | 2016 IEEE International Nanoelectronics Conference - Chengdu, China Duration: 9 May 2016 → 11 May 2016 http://www.inec2016.com/ |
Conference
Conference | 2016 IEEE International Nanoelectronics Conference |
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Abbreviated title | INEC |
Country/Territory | China |
City | Chengdu |
Period | 9/05/16 → 11/05/16 |
Internet address |
Keywords
- Neuromorphics
- Aging
- Thermal resistance
- Thermal expansion
- Integrated circuit modeling
- Finite element analysis
- Semiconductor device modeling