Thermal management of compact SMT multilayer power converters

I Josifovic, J Popovi¿-Gerber, JA Ferreira

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    4 Citations (Scopus)


    This paper presents thermal management considerations for a multilayer stacked converter construction technology Power Sandwich. The multilayer converters are built using novel x-dim components that have uniform height and double-sided SMT terminals. The SMT terminals of the components are soldered to two substrates and together with the substrate metallisation form copper-conductors reinforced multilayer assembly. Such structure has enhanced thermal performance as is shown in the paper. The concept enable more uniform distribution in the systems with non-uniform power loss distribution as proven by CFD simulations and experimental demonstrators, thus simplifying the design procedure of power sandwich converters. Analytical thermal models for forced and natural convection heat transfer from multilayer converters are developed and experimentally validated. The thermal design procedures and models are illustrated on constructed high power density sandwich demonstrators: 150W HID lamp electronic ballast and 2.2kW inverter for motor drive.
    Original languageEnglish
    Title of host publicationProceedings 2011 IEEE Energy Conversion Congress and Exposition
    EditorsJM Miller, U Deshpande
    Place of PublicationPiscataway, NJ, U.S.A.
    PublisherIEEE Society
    Number of pages8
    ISBN (Print)978-1-4577-0542-7
    Publication statusPublished - 2011
    EventIEEE Energy Conversion Congress and Exposition, ECCE 2011 - Piscataway, NJ, U.S.A.
    Duration: 17 Sep 201122 Sep 2011

    Publication series



    ConferenceIEEE Energy Conversion Congress and Exposition, ECCE 2011


    • conference contrib. refereed
    • Conf.proc. > 3 pag


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