Fingerprint
Dive into the research topics of 'Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm
Wei Chen, Xuyang Yan, Mesfin S. Ibrahim, Abdulmelik H. Meda, Xuejun Fan, Guoqi Zhang, Jiajie Fan*
*Corresponding author for this work
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
1
Citation
(Scopus)
23
Downloads
(Pure)