Thermal-mechanical stress and fatigue failure analysis of a PBGA

X Hao, L Qin, D Yang, S Liu

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

7 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationICEPT 2003
EditorsK Bi, PG Barnwell, J Wang
Place of PublicationPiscataway
PublisherIEEE Society
Pages438-442
Number of pages5
ISBN (Print)0-7803-8168-8
Publication statusPublished - 2003
Event5th international conference on electronic packaging technology, Shanghai - Piscataway
Duration: 28 Oct 200330 Oct 2003

Publication series

Name
PublisherIEEE

Conference

Conference5th international conference on electronic packaging technology, Shanghai
Period28/10/0330/10/03

Keywords

  • Conf.proc. > 3 pag

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