Thermal simulation of flexible LED package enhanced with copper pillars

Y Liu, SYY Leung, CKY Wong, CA Yuan, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

8 Citations (Scopus)
Original languageEnglish
Pages (from-to)064011-1-064011-4
JournalJournal of Semiconductors
Volume36
Issue number6
DOIs
Publication statusPublished - 2015

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