Thermal simulation of flexible LED package enhanced with copper pillars

Y Liu, SYY Leung, CKY Wong, CA Yuan, GQ Zhang

Research output: Contribution to journal › Article › Scientific › peer-review

8 Citations (Scopus)

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Revised manuscript received 9-11-2014

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@article{a0e36f80df9f400888feeb5e891e7388,

title = "Thermal simulation of flexible LED package enhanced with copper pillars",

author = "Y Liu and SYY Leung and CKY Wong and CA Yuan and GQ Zhang",

note = "Harvest Revised manuscript received 9-11-2014",

year = "2015",

doi = "10.1088/1674-4926/36/6/064011",

language = "English",

volume = "36",

pages = "064011--1--064011--4",

journal = "Journal of Semiconductors",

issn = "1674-4926",

publisher = "IOS Press",

number = "6",

}

TY - JOUR

T1 - Thermal simulation of flexible LED package enhanced with copper pillars

AU - Liu, Y

AU - Leung, SYY

AU - Wong, CKY

AU - Yuan, CA

AU - Zhang, GQ

N1 - Harvest Revised manuscript received 9-11-2014

PY - 2015

Y1 - 2015

U2 - 10.1088/1674-4926/36/6/064011

DO - 10.1088/1674-4926/36/6/064011

M3 - Article

SN - 1674-4926

VL - 36

SP - 064011-1-064011-4

JO - Journal of Semiconductors

JF - Journal of Semiconductors

IS - 6

ER -