Thermally enhanced SMT power components

I Josifovic, J Popovi¿-Gerber, JA Ferreira

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Abstract

    The paper introduces new x-dimension (x-dim) components that allow for high components packaging density and automated manufacturing of power converters. The x-dim components are double sided SMT passives, having uniform height (x) and enhanced thermal properties. With stacked converter construction and the x-dim components soldered to two sides, the heat removal from the systems can be significantly improved. This publication presents various methods to manufacture thermally enhanced x-dim components. The thermal behaviour of x-dim components is improved by integrating heat extractors, removing packaging materials and filling the air gaps by potting compounds. In the stacked construction, thermal enhancement of one component improves heat removal from other components, placed in adjacent stack layers. Thermal performance of x-dim components in both standard and stacked converter constructions is evaluated by FEM and analytical simulations. New x-dim components employed in stacked construction play a key role in overcoming current power density limits.
    Original languageUndefined/Unknown
    Title of host publicationProceedings IEEE Energy conversion congress and exposition, ECCE 2009
    Editors s.n.
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages1017-1024
    Number of pages8
    ISBN (Print)978-1-4244-2893-9
    DOIs
    Publication statusPublished - 2009
    EventIEEE Energy conversion congress and exposition, ECCE 2009, San Jose, USA - Piscataway
    Duration: 20 Sep 200924 Sep 2009

    Publication series

    Name
    PublisherIEEE

    Conference

    ConferenceIEEE Energy conversion congress and exposition, ECCE 2009, San Jose, USA
    Period20/09/0924/09/09

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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