Thermally induced delamination-buckling in a copper-ceramic microelectronic product

CJ Liu; G.Q. Zhang; LJ Ernst; G Wisse

Thermally induced delamination-buckling in a copper-ceramic microelectronic product

CJ Liu, G.Q. Zhang, LJ Ernst, G Wisse

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)electronics, April 9-11
Editors	LJ Ernst, de O Saint Leger, GQ Zhang
Place of Publication	Paris
Publisher	Europia
Pages	75-82
Number of pages	8
ISBN (Print)	0-7803-9806-8
Publication status	Published - 2001
Event	EuroSimE 2001 - Paris, France Duration: 9 Apr 2001 → 11 Apr 2001

Publication series

Name
Publisher	Europia

Conference

Conference	EuroSimE 2001
Country/Territory	France
City	Paris
Period	9/04/01 → 11/04/01

Keywords

ZX Int.klas.verslagjaar < 2002

Cite this

@inproceedings{24a2494af408466a977f404f2184ef2c,

title = "Thermally induced delamination-buckling in a copper-ceramic microelectronic product",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "CJ Liu and G.Q. Zhang and LJ Ernst and G Wisse",

year = "2001",

language = "Undefined/Unknown",

isbn = "0-7803-9806-8",

publisher = "Europia",

pages = "75--82",

editor = "{LJ Ernst} and {O Saint Leger}, de and {GQ Zhang}",

booktitle = "Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)electronics, April 9-11",

note = "EuroSimE 2001 ; Conference date: 09-04-2001 Through 11-04-2001",

}

Liu, CJ, Zhang, GQ, Ernst, LJ & Wisse, G 2001, Thermally induced delamination-buckling in a copper-ceramic microelectronic product. in LJ Ernst, D O Saint Leger & GQ Zhang (eds), Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)electronics, April 9-11. Europia, Paris, pp. 75-82, EuroSimE 2001, Paris, France, 9/04/01.

Thermally induced delamination-buckling in a copper-ceramic microelectronic product. / Liu, CJ; Zhang, G.Q.; Ernst, LJ et al.
Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)electronics, April 9-11. ed. / LJ Ernst; de O Saint Leger; GQ Zhang. Paris: Europia, 2001. p. 75-82.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Thermally induced delamination-buckling in a copper-ceramic microelectronic product

AU - Liu, CJ

AU - Zhang, G.Q.

AU - Ernst, LJ

AU - Wisse, G

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-7803-9806-8

SP - 75

EP - 82

BT - Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)electronics, April 9-11

A2 - LJ Ernst, null

A2 - O Saint Leger, de

A2 - GQ Zhang, null

PB - Europia

CY - Paris

T2 - EuroSimE 2001

Y2 - 9 April 2001 through 11 April 2001

ER -