Thermally induced delamination buckling of a thin metal layer on a ceramic substrate

CJ Liu, LJ Ernst, G Wisse, GQ Zhang, M Vervoort

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)512-519
Number of pages8
JournalJournal of Electronic Packaging
Issue number4
Publication statusPublished - 2003


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