Thermally induced delamination buckling of a thin metal layer on a ceramic substrate

CJ Liu, LJ Ernst, G Wisse, GQ Zhang, M Vervoort

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)512-519
Number of pages8
JournalJournal of Electronic Packaging
Volume125
Issue number4
Publication statusPublished - 2003

Keywords

  • ZX CWTS 1.00 <= JFIS < 3.00

Cite this

Liu, CJ., Ernst, LJ., Wisse, G., Zhang, GQ., & Vervoort, M. (2003). Thermally induced delamination buckling of a thin metal layer on a ceramic substrate. Journal of Electronic Packaging, 125(4), 512-519.