Thermo-mechanical characterization of packaging polymers during the curing process (niet eerder opgenomen)

C van t Hof, DG Yang, MS Kiasat, LJ Ernst, ? et al

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Original languageUndefined/Unknown
Title of host publicationProceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanics physics, reliability, processing, December 12-15
Editors E Suhir, et al
Place of PublicationNew York
PublisherASME
Pages153-158
Number of pages6
ISBN (Print)0-7918-1663-X
Publication statusPublished - 1999
Eventworkshop on polymeric materials for microelectronics and photonics applications: mechanics physics, reliability, processing - Paris
Duration: 12 Dec 200015 Dec 2000

Publication series

Name
PublisherASME

Conference

Conferenceworkshop on polymeric materials for microelectronics and photonics applications: mechanics physics, reliability, processing
CityParis
Period12/12/0015/12/00

Keywords

  • ZX Int.klas.verslagjaar < 2002

Cite this

van t Hof, C., Yang, DG., Kiasat, MS., Ernst, LJ., & et al, . (1999). Thermo-mechanical characterization of packaging polymers during the curing process (niet eerder opgenomen). In E Suhir, & et al (Eds.), Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanics physics, reliability, processing, December 12-15 (pp. 153-158). ASME.