Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Jing Jiang; Wei Chen; Yichen Qian; Abdulmelik H. Meda; Xuejun Fan; Guoqi Zhang; Jiajie Fan

doi:10.1109/TCPMT.2023.3267411

Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Jing Jiang, Wei Chen, Yichen Qian, Abdulmelik H. Meda, Xuejun Fan, Guoqi Zhang, Jiajie Fan

Electronic Components, Technology and Materials

Research output: Contribution to journal › Article › Scientific › peer-review

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Abstract

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve superior reliability of packaging, we applied the nondominated sorting genetic algorithm with elitist strategy (NSGA-II) and ant colony optimization-backpropagation neural network (ACO-BPNN) to optimize the design of redistribution layer (RDL) in FOPLP. We first quantified the thermal resistance and thermomechanical coupling stress of the designed package under thermal cycling loading. Next, NSGA-II and ACO-BPNN were used to optimize the size of the RDL blind via. Finally, the effectiveness of the proposed reliability optimization methods was verified by performing thermal shock reliability aging tests on the prepared devices.

Original language	English
Pages (from-to)	481-488
Number of pages	8
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	13
Issue number	4
DOIs	https://doi.org/10.1109/TCPMT.2023.3267411
Publication status	Published - 2023

Bibliographical note

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

Ant Colony Neural Network
Fan-out panel-level packaging
Genetic Algorithm
MOSFET
Packaging
Power device
Reliability
Reliability optimization
Stress
Thermal resistance
Thermal stresses
Thermomechanical processes

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Cite this

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title = "Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network",

abstract = "Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve superior reliability of packaging, we applied the nondominated sorting genetic algorithm with elitist strategy (NSGA-II) and ant colony optimization-backpropagation neural network (ACO-BPNN) to optimize the design of redistribution layer (RDL) in FOPLP. We first quantified the thermal resistance and thermomechanical coupling stress of the designed package under thermal cycling loading. Next, NSGA-II and ACO-BPNN were used to optimize the size of the RDL blind via. Finally, the effectiveness of the proposed reliability optimization methods was verified by performing thermal shock reliability aging tests on the prepared devices.",

keywords = "Ant Colony Neural Network, Fan-out panel-level packaging, Genetic Algorithm, MOSFET, Packaging, Power device, Reliability, Reliability optimization, Stress, Thermal resistance, Thermal stresses, Thermomechanical processes",

author = "Jing Jiang and Wei Chen and Yichen Qian and Meda, {Abdulmelik H.} and Xuejun Fan and Guoqi Zhang and Jiajie Fan",

note = "Green Open Access added to TU Delft Institutional Repository {\textquoteleft}You share, we take care!{\textquoteright} – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. ",

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language = "English",

volume = "13",

pages = "481--488",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

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publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

number = "4",

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Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network. / Jiang, Jing; Chen, Wei; Qian, Yichen et al.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 13, No. 4, 2023, p. 481-488.

Research output: Contribution to journal › Article › Scientific › peer-review

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AU - Fan, Xuejun

AU - Zhang, Guoqi

AU - Fan, Jiajie

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PY - 2023

Y1 - 2023

N2 - Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve superior reliability of packaging, we applied the nondominated sorting genetic algorithm with elitist strategy (NSGA-II) and ant colony optimization-backpropagation neural network (ACO-BPNN) to optimize the design of redistribution layer (RDL) in FOPLP. We first quantified the thermal resistance and thermomechanical coupling stress of the designed package under thermal cycling loading. Next, NSGA-II and ACO-BPNN were used to optimize the size of the RDL blind via. Finally, the effectiveness of the proposed reliability optimization methods was verified by performing thermal shock reliability aging tests on the prepared devices.

AB - Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve superior reliability of packaging, we applied the nondominated sorting genetic algorithm with elitist strategy (NSGA-II) and ant colony optimization-backpropagation neural network (ACO-BPNN) to optimize the design of redistribution layer (RDL) in FOPLP. We first quantified the thermal resistance and thermomechanical coupling stress of the designed package under thermal cycling loading. Next, NSGA-II and ACO-BPNN were used to optimize the size of the RDL blind via. Finally, the effectiveness of the proposed reliability optimization methods was verified by performing thermal shock reliability aging tests on the prepared devices.

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Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

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