Thermo-mechanical stress analysis for a multilayer SMT manfacturing technology

I Josifovic; J Popovi¿-Gerber; JA Ferreira

Thermo-mechanical stress analysis for a multilayer SMT manfacturing technology

I Josifovic, J Popovi¿-Gerber, JA Ferreira

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	6th International Conference on Integrated Power Electronics Systems
Editors	A Rufer
Place of Publication	Berlin, Germany
Publisher	VDE Verlag GMBH
Pages	1-6
Number of pages	6
ISBN (Print)	978-3-8007-3212-8
Publication status	Published - 2010
Event	CIPS 2010, 6th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany - Berlin, Germany Duration: 16 May 2010 → 18 May 2010

Publication series

Name
Publisher	VDE Verlag GmbH

Conference

Conference	CIPS 2010, 6th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany
Period	16/05/10 → 18/05/10

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{b928f17fabde4946a71fce3ec8455a7c,

title = "Thermo-mechanical stress analysis for a multilayer SMT manfacturing technology",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "I Josifovic and J Popovi¿-Gerber and JA Ferreira",

year = "2010",

language = "English",

isbn = "978-3-8007-3212-8",

publisher = "VDE Verlag GMBH",

pages = "1--6",

editor = "A Rufer",

booktitle = "6th International Conference on Integrated Power Electronics Systems",

note = "CIPS 2010, 6th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany ; Conference date: 16-05-2010 Through 18-05-2010",

}

Josifovic, I, Popovi¿-Gerber, J & Ferreira, JA 2010, Thermo-mechanical stress analysis for a multilayer SMT manfacturing technology. in A Rufer (ed.), 6th International Conference on Integrated Power Electronics Systems. VDE Verlag GMBH, Berlin, Germany, pp. 1-6, CIPS 2010, 6th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, 16/05/10.

Thermo-mechanical stress analysis for a multilayer SMT manfacturing technology. / Josifovic, I; Popovi¿-Gerber, J; Ferreira, JA.
6th International Conference on Integrated Power Electronics Systems. ed. / A Rufer. Berlin, Germany: VDE Verlag GMBH, 2010. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Thermo-mechanical stress analysis for a multilayer SMT manfacturing technology

AU - Josifovic, I

AU - Popovi¿-Gerber, J

AU - Ferreira, JA

PY - 2010

Y1 - 2010

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-3-8007-3212-8

SP - 1

EP - 6

BT - 6th International Conference on Integrated Power Electronics Systems

A2 - Rufer, A

PB - VDE Verlag GMBH

CY - Berlin, Germany

T2 - CIPS 2010, 6th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany

Y2 - 16 May 2010 through 18 May 2010

ER -