Thickness evaluation of deposited pureb layers in micro-/millimeter-sized windows to Si

V Mohammadi; S Ramesh; LK Nanver

doi:10.1109/ICMTS.2014.6841492

Thickness evaluation of deposited pureb layers in micro-/millimeter-sized windows to Si

V Mohammadi, S Ramesh, LK Nanver

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

16 Citations (Scopus)

Original language	English
Title of host publication	Proceedings - 2014 IEEE International Conference on Microelectronic Test Structures
Editors	L Selmi, J Klootwijk, G Meneghesso, A Toffoli, F Driussi
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	194-199
Number of pages	6
ISBN (Print)	978-1-4799-2192-8
DOIs	https://doi.org/10.1109/ICMTS.2014.6841492
Publication status	Published - 2014
Event	CMTS 2014, Udine, Italy - Piscataway, NJ, USA Duration: 24 Mar 2014 → 27 Mar 2014

Publication series

Name
Publisher	IEEE

Conference

Conference	CMTS 2014, Udine, Italy
Period	24/03/14 → 27/03/14

Bibliographical note

Harvest

Access to Document

10.1109/ICMTS.2014.6841492

Cite this

@inproceedings{6812f9b8fa98415fb7ee2013aa9dcff5,

title = "Thickness evaluation of deposited pureb layers in micro-/millimeter-sized windows to Si",

author = "V Mohammadi and S Ramesh and LK Nanver",

note = "Harvest; CMTS 2014, Udine, Italy ; Conference date: 24-03-2014 Through 27-03-2014",

year = "2014",

doi = "10.1109/ICMTS.2014.6841492",

language = "English",

isbn = "978-1-4799-2192-8",

publisher = "IEEE Society",

pages = "194--199",

editor = "L Selmi and J Klootwijk and G Meneghesso and A Toffoli and F Driussi",

booktitle = "Proceedings - 2014 IEEE International Conference on Microelectronic Test Structures",

}

Mohammadi, V, Ramesh, S & Nanver, LK 2014, Thickness evaluation of deposited pureb layers in micro-/millimeter-sized windows to Si. in L Selmi, J Klootwijk, G Meneghesso, A Toffoli & F Driussi (eds), Proceedings - 2014 IEEE International Conference on Microelectronic Test Structures. IEEE Society, Piscataway, NJ, USA, pp. 194-199, CMTS 2014, Udine, Italy, 24/03/14. https://doi.org/10.1109/ICMTS.2014.6841492

Thickness evaluation of deposited pureb layers in micro-/millimeter-sized windows to Si. / Mohammadi, V; Ramesh, S; Nanver, LK.
Proceedings - 2014 IEEE International Conference on Microelectronic Test Structures. ed. / L Selmi; J Klootwijk; G Meneghesso; A Toffoli; F Driussi. Piscataway, NJ, USA: IEEE Society, 2014. p. 194-199.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Thickness evaluation of deposited pureb layers in micro-/millimeter-sized windows to Si

AU - Mohammadi, V

AU - Ramesh, S

AU - Nanver, LK

N1 - Harvest

PY - 2014

Y1 - 2014

U2 - 10.1109/ICMTS.2014.6841492

DO - 10.1109/ICMTS.2014.6841492

M3 - Conference contribution

SN - 978-1-4799-2192-8

SP - 194

EP - 199

BT - Proceedings - 2014 IEEE International Conference on Microelectronic Test Structures

A2 - Selmi, L

A2 - Klootwijk, J

A2 - Meneghesso, G

A2 - Toffoli, A

A2 - Driussi, F

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - CMTS 2014, Udine, Italy

Y2 - 24 March 2014 through 27 March 2014

ER -