@inproceedings{07727a73acd2489ea5999b9c5d933586,
title = "Thin-film MEMS encapsulation using low-stress PECVD silicon carbide",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "V Rajaraman and L Pakula and HTM Pham and PM Sarro and PJ French",
year = "2008",
language = "Undefined/Unknown",
isbn = "ISBN 978-3-00-025217-4",
publisher = "Eurosensors",
pages = "491--494",
editor = "G Gerlach",
booktitle = "Proceedings Eurosensors XXII",
note = "Eurosensors XXII ; Conference date: 07-09-2008 Through 10-09-2008",
}