Thinning of micromachined wafers for high-density, through-wafer interconnects

L Wang, CCG Visser, CR de Boer, M Laros, W van der Vlist, J Groeneweg, G Craciun, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationProceedings of SAFE 2002
Place of PublicationUtrecht
PublisherSTW Stichting voor de Technische Wetenschappen
Pages121-126
Number of pages6
ISBN (Print)90-73461-33-2
Publication statusPublished - 2002
EventSAFE 2002 ProRISC 2002 SeSens 2002 Veldhoven, the Netherlands - Utrecht
Duration: 27 Nov 200228 Nov 2002

Publication series

Name
PublisherSTW Stichting voor de Technische Wetenschappen

Conference

ConferenceSAFE 2002 ProRISC 2002 SeSens 2002 Veldhoven, the Netherlands
Period27/11/0228/11/02

Keywords

  • Conf.proc. > 3 pag

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