@inproceedings{19e322bc46554b6e8ef9603e51608a90,
title = "Thinning of micromachined wafers for high-density, through-wafer interconnects",
keywords = "Conf.proc. > 3 pag",
author = "L Wang and CCG Visser and {de Boer}, CR and M Laros and {van der Vlist}, W and J Groeneweg and G Craciun and PM Sarro",
year = "2002",
language = "Undefined/Unknown",
isbn = "90-73461-33-2",
publisher = "STW Stichting voor de Technische Wetenschappen",
pages = "121--126",
booktitle = "Proceedings of SAFE 2002",
note = "null ; Conference date: 27-11-2002 Through 28-11-2002",
}