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Through Package Via: A bottom-up approach
Daniel Yi
Electronic Components, Technology and Materials
Research output
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Thesis
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Dissertation (TU Delft)
757
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INIS
polymers
100%
aspect ratio
62%
density
62%
cost
62%
applications
37%
packaging
37%
levels
25%
coatings
25%
films
25%
semiconductor materials
25%
industry
25%
increasing
12%
molding
12%
production
12%
manufacturing
12%
semiconductor devices
12%
fabrication
12%
wires
12%
range
12%
molds
12%
metals
12%
reliability
12%
people
12%
silicon
12%
boundary conditions
12%
growth
12%
spin-on coating
12%
panels
12%
sizing
12%
Material Science
Density
100%
Polymer Structure
60%
Semiconductor Material
40%
Film
40%
Lithography
40%
Silicon
20%
Semiconductor Device
20%
Spin Coating
20%
Fluidics
20%
Metal Coating
20%
Functional Surface
20%
Engineering
High Density
50%
Polymer Material
33%
Interconnection
33%
Semiconductor
33%
Limitations
16%
Fabrication Approach
16%
Past Decade
16%
Density Ratio
16%
Interconnects
16%
Aspect Ratio
16%
Two Dimensional
16%
Development
16%
Density
16%
Broad Range
16%
Gas Fuel Manufacture
16%
Key Process
16%
Main Process
16%
Chemical Engineering
Polymer
100%
Silicon
12%
Scalability
12%
Spin Coating
12%