Through-Polymer-Via for 3D heterogeneous integration and packaging, and method of manufacture thereof

RH Poelma (Inventor), GQ Zhang (Inventor), HW van Zeijl (Inventor)

Research output: Patent

Original languageEnglish
Patent number2010077
Priority date3/07/14
Publication statusPublished - 2014

Bibliographical note

OCT-12-055

Cite this