Through-polymer-via for 3D heterogeneous integration and packaging

J. Hamelink, Rene Poelma, M. Kengen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Fingerprint Dive into the research topics of 'Through-polymer-via for 3D heterogeneous integration and packaging'. Together they form a unique fingerprint.

Physics & Astronomy