Through-wafer copper electroplating for RF silicon technology

NT Nguyen, TK Ng, E Boellaard, NP Pham, G Craciun, PM Sarro, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	ESSDERC 2002 32nd European Solid-State Device Research Conference
Place of Publication	Bologna, Italy
Publisher	University of Bologna
Pages	255-258
Number of pages	4
Publication status	Published - 2002
Event	ESSDERC 2002, Firenze, Italy - Bologna, Italy Duration: 24 Sept 2002 → 26 Sept 2002

Name
Publisher	University of Bologna

Conference	ESSDERC 2002, Firenze, Italy
Period	24/09/02 → 26/09/02

Keywords

@inproceedings{7baeeee62ea64dd7a1abcccb74af63ba,

title = "Through-wafer copper electroplating for RF silicon technology",

keywords = "Conf.proc. > 3 pag",

author = "NT Nguyen and TK Ng and E Boellaard and NP Pham and G Craciun and PM Sarro and JN Burghartz",

year = "2002",

language = "Undefined/Unknown",

publisher = "University of Bologna",

pages = "255--258",

booktitle = "ESSDERC 2002 32nd European Solid-State Device Research Conference",

note = "ESSDERC 2002, Firenze, Italy ; Conference date: 24-09-2002 Through 26-09-2002",

}

TY - GEN

T1 - Through-wafer copper electroplating for RF silicon technology

AU - Nguyen, NT

AU - Ng, TK

AU - Boellaard, E

AU - Pham, NP

AU - Craciun, G

AU - Sarro, PM

AU - Burghartz, JN

PY - 2002

Y1 - 2002

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 255

EP - 258

BT - ESSDERC 2002 32nd European Solid-State Device Research Conference

PB - University of Bologna

CY - Bologna, Italy

T2 - ESSDERC 2002, Firenze, Italy

Y2 - 24 September 2002 through 26 September 2002

ER -