Through-wafer copper electroplating for RF silicon technology

NT Nguyen, TK Ng, E Boellaard, NP Pham, G Craciun, PM Sarro, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationESSDERC 2002 32nd European Solid-State Device Research Conference
Place of PublicationBologna, Italy
PublisherUniversity of Bologna
Pages255-258
Number of pages4
Publication statusPublished - 2002
EventESSDERC 2002, Firenze, Italy - Bologna, Italy
Duration: 24 Sep 200226 Sep 2002

Publication series

Name
PublisherUniversity of Bologna

Conference

ConferenceESSDERC 2002, Firenze, Italy
Period24/09/0226/09/02

Keywords

  • Conf.proc. > 3 pag

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