Through-wafer copper electroplating for three-dimensional interconnects

NT Nguyen, E Boellaard, NP Pham, VG Kutchoukov, G Craciun, PM Sarro

Research output: Contribution to journalArticleScientificpeer-review

116 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)395-399
Number of pages5
JournalJournal of Micromechanics and Microengineering
Volume12
Publication statusPublished - 2002

Keywords

  • Elektrotechniek
  • Techniek
  • ZX CWTS 1.00 <= JFIS < 3.00

Cite this

Nguyen, NT., Boellaard, E., Pham, NP., Kutchoukov, VG., Craciun, G., & Sarro, PM. (2002). Through-wafer copper electroplating for three-dimensional interconnects. Journal of Micromechanics and Microengineering, 12, 395-399.