Through-wafer copper electroplating for three-dimensional interconnects

NT Nguyen, E Boellaard, NP Pham, VG Kutchoukov, G Craciun, PM Sarro

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	395-399
Number of pages	5
Journal	Journal of Micromechanics and Microengineering
Volume	12
Publication status	Published - 2002

Keywords

@article{40bb7272f8344ea78156ac455a8dcdc8,

title = "Through-wafer copper electroplating for three-dimensional interconnects",

keywords = "Elektrotechniek, Techniek, ZX CWTS 1.00 <= JFIS < 3.00",

author = "NT Nguyen and E Boellaard and NP Pham and VG Kutchoukov and G Craciun and PM Sarro",

year = "2002",

language = "Undefined/Unknown",

volume = "12",

pages = "395--399",

journal = "Journal of Micromechanics and Microengineering",

issn = "0960-1317",

publisher = "IOP Publishing",

}

TY - JOUR

T1 - Through-wafer copper electroplating for three-dimensional interconnects

AU - Nguyen, NT

AU - Boellaard, E

AU - Pham, NP

AU - Kutchoukov, VG

AU - Craciun, G

AU - Sarro, PM

PY - 2002

Y1 - 2002

KW - Elektrotechniek

KW - Techniek

KW - ZX CWTS 1.00 <= JFIS < 3.00

M3 - Article

SN - 0960-1317

VL - 12

SP - 395

EP - 399

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

ER -