@inproceedings{25ca0ea09b8d4426b40579fe3a108949,
title = "Through-wafer electrical vias for RF silicon technology",
keywords = "Vakpubl., Overig wet. > 3 pag",
author = "Z Wang and L Wang and H Schellevis and WHA Wien and JN Burghartz and PM Sarro",
note = "CD-ROM; Semiconductor advances for future electronics, Veldhoven, The Netherlands ; Conference date: 25-11-2003 Through 26-11-2003",
year = "2003",
language = "Undefined/Unknown",
isbn = "90-73461-39-1",
publisher = "Stichting voor de Technische Wetenschap",
pages = "761--765",
editor = "s.n.",
booktitle = "SAFE 2003 Proceedings of semiconductor advances for future electronics",
}