Time- and tempearature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses

LJ Ernst, GQ Zhang, KMB Jansen, HJL Bressers

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	539-548
Number of pages	10
Journal	Journal of Electronic Packaging
Volume	125
Issue number	4
Publication status	Published - 2003

Keywords

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title = "Time- and tempearature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses",

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language = "Undefined/Unknown",

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TY - JOUR

T1 - Time- and tempearature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses

AU - Ernst, LJ

AU - Zhang, GQ

AU - Jansen, KMB

AU - Bressers, HJL

PY - 2003

Y1 - 2003

KW - ZX CWTS 1.00 <= JFIS < 3.00

M3 - Article

SN - 1043-7398

VL - 125

SP - 539

EP - 548

JO - Journal of Electronic Packaging

JF - Journal of Electronic Packaging

IS - 4

ER -