Time dependent behavior of molding compound in packaging

G Wisse, KMB Jansen, LJ Ernst, MS Kiasat, ? et al

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Original languageUndefined/Unknown
Title of host publication13th European microelectronics and packaging conference, May 30-31
Place of PublicationReston
PublisherInternational Microelectronics and Packaging Society
Pages389-392
Number of pages4
Publication statusPublished - 2001
Event13th European microelectronics and packaging conference - Reston
Duration: 30 May 200131 May 2001

Publication series

Name
PublisherInternational Microelectronics and Packaging Society

Conference

Conference13th European microelectronics and packaging conference
Period30/05/0131/05/01

Keywords

  • ZX Int.klas.verslagjaar < 2002

Cite this

Wisse, G., Jansen, KMB., Ernst, LJ., Kiasat, MS., & et al, . (2001). Time dependent behavior of molding compound in packaging. In 13th European microelectronics and packaging conference, May 30-31 (pp. 389-392). International Microelectronics and Packaging Society.