Towards a Scalable Sun Position Sensor with Monolithic Integration of the 3d Optics for Miniaturized Satellite Attitude Control

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

In this paper we present a sun position sensor platform with a scalable approach for the 3D integration of the sensor optics. This would facilitate the sun position sensor miniaturization, reduces fabrication cost and mitigates the need for sensor calibration. The sun position sensor platform is implemented in a seven mask BICMOS technology with optical windows between the light masking layer and CMOS image sensor implemented by adhesively bonded glass windows. The CMOS sensor functionality is experimentally verified by modulation of a light spot using a laser. The proposed approach enables wafer-scale fabrication of the 3D optics that includes the wafer stepper accurate overlay alignment of the apertures. This mitigates the need for cumbersome alignment of the apertures at die or package level and facilitates further miniaturization, accuracy and sensor cost.
Original languageEnglish
Title of host publication2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
PublisherIEEE
Pages642-645
Number of pages4
ISBN (Electronic)978-1-6654-1912-3
ISBN (Print)978-1-6654-3024-1
DOIs
Publication statusPublished - 2021
Event2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) - Gainesville/Online, United States
Duration: 25 Jan 202129 Jan 2021
Conference number: 34

Conference

Conference2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
CountryUnited States
CityGainesville/Online
Period25/01/2129/01/21

Keywords

  • 3D integrated optics
  • sun position sensor
  • CMOS image sensor
  • adhesive bonding

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