Towards a wireless system that can monitor the encapsulation of mm-sized active implants in vivo for bioelectronic medicine

Gonçalo Rodrigues, Mariana Neca, João Silva, Diogo Brito, Taimur Rabuske, Jorge Fernandes, Rainer Mohrlok, Christoph Jeschke, Jannis Meents, Kambiz Nanbakhsh, Vasiliki Giagka

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

Active neural interfaces for bioelectronic medicine are envisioned to be mm-sized. Such miniaturization is at the moment hampered by the available wireless power techniques as well as the large volume the conventional hermetic packaging adds to the implant. Alternatively, conformal coatings are being explored for the protection of the implant electronics. Such approach has the potential to allow for the use of RF (radio-frequency) energy for powering, and miniaturization to the extreme of having a single IC (integrated circuit) as the whole implant (single chip implants). The longevity of conformal encapsulation can be assessed using accelerated soak tests in a dedicated apparatus in vitro, but these are usually not sufficient, as they fail to reveal additional failure modes that manifest themselves in vivo. Therefore, to investigate the performance of conformal coatings in vivo a compact, mm-sized wireless monitoring system is required. The development of such a system exhibits several challenges, mostly concerned with how to receive enough energy in such a small implant to power the monitoring sensor and transmit information regarding the integrity of the coating. In this paper we propose a system architecture for such a mm-sized wireless system, suitable for medium-to-Iong term monitoring of implants, by designing the whole system as a single monolithic IC. It is shown, by experiments, simulation or analytically that the identified challenges are possible to overcome, allowing to proceed towards the practical prototype.

Original languageEnglish
Title of host publication2021 10th International IEEE/EMBS Conference on Neural Engineering (NER)
PublisherIEEE
Pages981-984
Number of pages4
ISBN (Electronic)978-1-7281-4337-8
ISBN (Print)978-1-7281-4338-5
DOIs
Publication statusPublished - 2021
Event10th International IEEE/EMBS Conference on Neural Engineering, NER 2021 - Virtual, Online, Italy
Duration: 4 May 20216 May 2021

Conference

Conference10th International IEEE/EMBS Conference on Neural Engineering, NER 2021
CountryItaly
CityVirtual, Online
Period4/05/216/05/21

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