Towards reel-to-reel integration of ultra-thin chips to polymer foils

M Tichem; M Cauwe; Z Hajdarevic; EE Kuran; B Naveh; A Sridhar; P Weissel

Towards reel-to-reel integration of ultra-thin chips to polymer foils

M Tichem, M Cauwe, Z Hajdarevic, EE Kuran, B Naveh, A Sridhar, P Weissel

Micro and Nano Engineering

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	English
Title of host publication	Electronic System-Integration Technology Conference (ESTC), 2012 4th
Editors	s.n.
Place of Publication	s.l.
Publisher	IEEE Society
Pages	1-6
Number of pages	6
ISBN (Print)	978-1-4673-4645-0
Publication status	Published - 2012
Event	2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands Duration: 17 Sept 2012 → 20 Sept 2012 Conference number: 4

Publication series

Name
Publisher	IEEE

Conference

Conference	2012 4th Electronic System-Integration Technology Conference (ESTC)
Abbreviated title	ESTC 2012
Country/Territory	Netherlands
City	Amsterdam
Period	17/09/12 → 20/09/12

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{beab8881247647989a42e4d05f233cd4,

title = "Towards reel-to-reel integration of ultra-thin chips to polymer foils",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Tichem and M Cauwe and Z Hajdarevic and EE Kuran and B Naveh and A Sridhar and P Weissel",

year = "2012",

language = "English",

isbn = "978-1-4673-4645-0",

publisher = "IEEE Society",

pages = "1--6",

editor = "s.n.",

booktitle = "Electronic System-Integration Technology Conference (ESTC), 2012 4th",

note = "2012 4th Electronic System-Integration Technology Conference (ESTC), ESTC 2012 ; Conference date: 17-09-2012 Through 20-09-2012",

}

Tichem, M, Cauwe, M, Hajdarevic, Z, Kuran, EE, Naveh, B, Sridhar, A & Weissel, P 2012, Towards reel-to-reel integration of ultra-thin chips to polymer foils. in s.n. (ed.), Electronic System-Integration Technology Conference (ESTC), 2012 4th. IEEE Society, s.l., pp. 1-6, 2012 4th Electronic System-Integration Technology Conference (ESTC), Amsterdam, Netherlands, 17/09/12.

TY - GEN

T1 - Towards reel-to-reel integration of ultra-thin chips to polymer foils

AU - Tichem, M

AU - Cauwe, M

AU - Hajdarevic, Z

AU - Kuran, EE

AU - Naveh, B

AU - Sridhar, A

AU - Weissel, P

N1 - Conference code: 4

PY - 2012

Y1 - 2012

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

UR - http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6542070&refinements%3D4281320619%2C4281493653%26sortType%3Dasc_p_Sequence%26filter%3DAND%28p_IS_Number%3A6522698%29

M3 - Conference contribution

SN - 978-1-4673-4645-0

SP - 1

EP - 6

BT - Electronic System-Integration Technology Conference (ESTC), 2012 4th

A2 - s.n., null

PB - IEEE Society

CY - s.l.

T2 - 2012 4th Electronic System-Integration Technology Conference (ESTC)

Y2 - 17 September 2012 through 20 September 2012

ER -

Towards reel-to-reel integration of ultra-thin chips to polymer foils

Publication series

Conference

Keywords

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Cite this