Abstract
This study introduces a training protocol utilizing Convolutional Neural Networks (CNNs) and Confocal Scanning Acoustic Microscopy (CSAM) imaging techniques to classify Power Quad Flat No-leads (PQFN) package delamination. The investigation involves empty PQFN packages with varied substrate metallizations subjected to thermal cycling. Four delamination classes were labeled: Die-pad delamination (Class-A), Bond-pad delamination (Class-B), both Die-pad and Bond-pad delamination (Class-C), and No delamination (Class-D). Due to data imbalance, additional randomness was introduced for distribution balancing. Residual Networks (ResNet-18) based CNN model was selected for classification. Five-fold cross-validation assessed overfitting performance concerning input data size, image resolution, and batch size. The ResNet-18 prediction performance was evaluated using precision and recall metrics, with the model achieving average precision and recall scores of 0.86/1 and 0.83/1, respectively. Additionally, a comparison of delamination among different substrate metallizations was presented with Ag and NiPdAu indicating significant delamination compared to bare Cu substrate. This study pioneers the integration of CNNs with CSAM imaging for package defect detection and classification, laying the groundwork for future research to address the complex interplay of multiple failure mechanisms in functional packages.
Original language | English |
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Title of host publication | Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
Publisher | IEEE |
Number of pages | 7 |
ISBN (Electronic) | 979-8-3503-9363-7 |
ISBN (Print) | 979-8-3503-9364-4 |
DOIs | |
Publication status | Published - 2024 |
Event | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Catania, Italy Duration: 7 Apr 2024 → 10 Apr 2024 Conference number: 25th |
Publication series
Name | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 |
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Conference
Conference | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
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Abbreviated title | EuriSimE 2024 |
Country/Territory | Italy |
City | Catania |
Period | 7/04/24 → 10/04/24 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- Package delamination
- Scanning Acoustic Microscopy
- Defect detection and Classification
- Deep learning
- Residual Networks