Trough-wafer copper plugs formation for 3-Dimensional ICs

NT Nguyen; E Boellaard; PN Pham; VG Kiutchoukov; G Cracium; PM Sarro

Trough-wafer copper plugs formation for 3-Dimensional ICs

NT Nguyen, E Boellaard, PN Pham, VG Kiutchoukov, G Cracium, PM Sarro

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology
Place of Publication	Utrecht
Publisher	STW Technology Foundation
Pages	141-144
Number of pages	4
ISBN (Print)	90-73461-29-4
Publication status	Published - 2001
Event	SAFE ProRISC SeSens 2001, Veldhoven - Utrecht Duration: 28 Nov 2001 → 30 Nov 2001

Publication series

Name
Publisher	STW technology foundation

Conference

Conference	SAFE ProRISC SeSens 2001, Veldhoven
Period	28/11/01 → 30/11/01

Keywords

ZX Int.klas.verslagjaar < 2002

Cite this

Nguyen, NT., Boellaard, E., Pham, PN., Kiutchoukov, VG., Cracium, G., & Sarro, PM. (2001). Trough-wafer copper plugs formation for 3-Dimensional ICs. In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology (pp. 141-144). STW Technology Foundation.

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title = "Trough-wafer copper plugs formation for 3-Dimensional ICs",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "NT Nguyen and E Boellaard and PN Pham and VG Kiutchoukov and G Cracium and PM Sarro",

year = "2001",

language = "Undefined/Unknown",

isbn = "90-73461-29-4",

publisher = "STW Technology Foundation",

pages = "141--144",

booktitle = "SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology",

note = "SAFE ProRISC SeSens 2001, Veldhoven ; Conference date: 28-11-2001 Through 30-11-2001",

}

Nguyen, NT, Boellaard, E, Pham, PN, Kiutchoukov, VG, Cracium, G & Sarro, PM 2001, Trough-wafer copper plugs formation for 3-Dimensional ICs. in SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology. STW Technology Foundation, Utrecht, pp. 141-144, SAFE ProRISC SeSens 2001, Veldhoven, 28/11/01.

Trough-wafer copper plugs formation for 3-Dimensional ICs. / Nguyen, NT; Boellaard, E; Pham, PN et al.
SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology. Utrecht: STW Technology Foundation, 2001. p. 141-144.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Trough-wafer copper plugs formation for 3-Dimensional ICs

AU - Nguyen, NT

AU - Boellaard, E

AU - Pham, PN

AU - Kiutchoukov, VG

AU - Cracium, G

AU - Sarro, PM

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 90-73461-29-4

SP - 141

EP - 144

BT - SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology

PB - STW Technology Foundation

CY - Utrecht

T2 - SAFE ProRISC SeSens 2001, Veldhoven

Y2 - 28 November 2001 through 30 November 2001

ER -

Nguyen NT, Boellaard E, Pham PN, Kiutchoukov VG, Cracium G, Sarro PM. Trough-wafer copper plugs formation for 3-Dimensional ICs. In SAFE - ProRISC - SeSens 2001: proceedings. Semiconductor Advances for Future Electronics - Program for Research on Integrated Systems and Circuits - Semiconductor Sensor and Actuator Technology. Utrecht: STW Technology Foundation. 2001. p. 141-144