Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology

LK Nanver; V Gonda; Y Civale; TLM Scholtes; L La Spina; H Schellevis; G Lorito; F Sarubbi; M Popadic; K Buisman; S Milosavljevic; EJG Goudena

Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology

LK Nanver, V Gonda, Y Civale, TLM Scholtes, L La Spina, H Schellevis, G Lorito, F Sarubbi, M Popadic, K Buisman, S Milosavljevic, EJG Goudena

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proc. 9th international conference on solid-state and integrated circuit technology
Editors	T.-A. Tang, H Ru, Y Min, A Xia
Place of Publication	s.l.
Publisher	ICSICT
Pages	1-4
Number of pages	4
ISBN (Print)	978-1-4244-2186-2
Publication status	Published - 2008
Event	ICSICT 2008 - Beijing, China Duration: 20 Oct 2008 → 23 Oct 2008

Publication series

Name
Publisher	ICSICT

Conference

Conference	ICSICT 2008
Country/Territory	China
City	Beijing
Period	20/10/08 → 23/10/08

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Nanver, LK., Gonda, V., Civale, Y., Scholtes, TLM., La Spina, L., Schellevis, H., Lorito, G., Sarubbi, F., Popadic, M., Buisman, K., Milosavljevic, S., & Goudena, EJG. (2008). Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology. In T.-A. Tang, H. Ru, Y. Min, & A. Xia (Eds.), Proc. 9th international conference on solid-state and integrated circuit technology (pp. 1-4). ICSICT.

@inproceedings{2f061a3446f140babe6787195dc045bc,

title = "Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "LK Nanver and V Gonda and Y Civale and TLM Scholtes and {La Spina}, L and H Schellevis and G Lorito and F Sarubbi and M Popadic and K Buisman and S Milosavljevic and EJG Goudena",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-1-4244-2186-2",

publisher = "ICSICT",

pages = "1--4",

editor = "T.-A. Tang and H Ru and Y Min and A Xia",

booktitle = "Proc. 9th international conference on solid-state and integrated circuit technology",

note = "ICSICT 2008 ; Conference date: 20-10-2008 Through 23-10-2008",

}

Nanver, LK, Gonda, V, Civale, Y, Scholtes, TLM, La Spina, L, Schellevis, H, Lorito, G, Sarubbi, F, Popadic, M, Buisman, K, Milosavljevic, S & Goudena, EJG 2008, Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology. in T-A Tang, H Ru, Y Min & A Xia (eds), Proc. 9th international conference on solid-state and integrated circuit technology. ICSICT, s.l., pp. 1-4, ICSICT 2008, Beijing, China, 20/10/08.

Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology. / Nanver, LK; Gonda, V; Civale, Y et al.
Proc. 9th international conference on solid-state and integrated circuit technology. ed. / T.-A. Tang; H Ru; Y Min; A Xia. s.l.: ICSICT, 2008. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology

AU - Nanver, LK

AU - Gonda, V

AU - Civale, Y

AU - Scholtes, TLM

AU - La Spina, L

AU - Schellevis, H

AU - Lorito, G

AU - Sarubbi, F

AU - Popadic, M

AU - Buisman, K

AU - Milosavljevic, S

AU - Goudena, EJG

PY - 2008

Y1 - 2008

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-2186-2

SP - 1

EP - 4

BT - Proc. 9th international conference on solid-state and integrated circuit technology

A2 - Tang, T.-A.

A2 - Ru, H

A2 - Min, Y

A2 - Xia, A

PB - ICSICT

CY - s.l.

T2 - ICSICT 2008

Y2 - 20 October 2008 through 23 October 2008

ER -