Ultrashort laser welding of PMMA to silicon

Annalisa Volpe*, Filippo Maria Conte Capodacqua, Caterina Gaudiuso, Antonio Ancona

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

1 Citation (Scopus)


Utilization of parts made by combining dissimilar materials, such as different polymers, metals, or semiconductor to polymers, are nowadays highly demanded for the fabrication of electronic, electromechanical, medical micro-devices, and analytical systems (e.g., lab-on-chip). Techniques for joining such hybrid micro-devices, generally based on gluing or thermal processes, remain a challenging task presenting some drawbacks, such as deterioration and contamination of the substrates. Ultrashort laser welding is a non-contact and flexible technique to precisely weld similar and dissimilar materials. In this case, the only constrain is that the upper substrate is transparent to the laser wavelength. This technique has been demonstrated both for welding polymers and polymers to metallic substrates, but never for joining polymers to silicon. In this work, we report on direct femtosecond laser welding of Poly(methyl methacrylate) (PMMA) and silicon. The laser welding was performed in ambient air by focusing ultrashort laser pulses at high repetition rate at the interface between the two, being PMMA transparent to the laser wavelength. A mechanical homogenous pressure was applied on the sandwiched substrates during all the laser process. The Si-PMMA weld strength was evaluated as a function of the laser and processing parameters, e.g., repetition rate, scan speed, and the overlap between adjacent scan lines.

Original languageEnglish
Title of host publicationLaser-based Micro- and Nanoprocessing XVI
EditorsAkira Watanabe, Rainer Kling
ISBN (Electronic)9781510648494
Publication statusPublished - 2022
Externally publishedYes
EventLaser-based Micro- and Nanoprocessing XVI 2022 - Virtual, Online
Duration: 20 Feb 202224 Feb 2022

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


ConferenceLaser-based Micro- and Nanoprocessing XVI 2022
CityVirtual, Online


  • fs-laser
  • lab on a chip
  • polymers
  • silicon
  • ultrashort laser
  • welding


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